Skip to content

Processes

Great added value through our solutions

Customized process engineering combined with precision electrolytes and additives – since the invention of stylus engraving, we have developed and manufactured innovative solutions for the gravure cylinder manufacturing industry.

The customer benefit is manifold: simple system-handling through built-in automation and high-quality chemicals and additives – produced and mixed in-house – that ensure highly successful results.

We understand customer requirements, processes and procedures. Our comprehensive overview contributes to a systematic, highly integrated product development phase in which we consider and coordinate all major machine and procedural aspects. This approach optimizes the processes that really count, leads to maximum cost-efficiency and increases the productivity and efficiency of our solutions.

Please click the image to open the interactive Galvanics Booklet.

Galvanik Chemie

Function

  • Electrolyte for dechroming
  • Based on sulfuric acid

-Cr

Helio® DeChrome

Dechroming


Advantages

  • Low power and rectifier times
  • Copper protecting
  • Fast de-plating time
  • High concentrate
  • Long lifetime
  • Easy to handle
  • Wide window of operation

Process Time

  • ~ 10 minutes

Process Parameter

  • Sulfuric Acid
  • Dechrome Concentrate
  • Process Temperature
  • Current
  • Voltage
  • ~ 30 %
  • 15 ml/l
  • 22–35°C
  • ±50–200 A (bipolar)
  • ±15 Volt (bipolar)

Availability

Helio® DeChrome Concentrate
Canister5 LiterArt.Nr. 104005
10 LiterArt.Nr. 104006
20 LiterArt.Nr. 104007
Helio® DeChrome Salt
Bottle1kgArt.Nr. 117590

Analysis

Analysis Set DeChromeArt.Nr. 01A.0.01.300
close

Function

  • Electrolyte for dechroming

-Cr

Helio® DeChrome
CHEMICAL

Dechroming


Advantages

  • No rectifier
  • Copper protecting
  • Fast de-plating time
  • High concentrated
  • Salt

Process Time

  • 2–5 minutes

Process Parameter

  • DeChrome Chemical
  • HCl 32 %
  • 120–350 g/l
  • 190–350 ml/l

Availability

Helio® DeChrome Chemical
Barrel25 kgArt.Nr. 109504

Analysis

Analysis Set DeChromeArt.Nr. 01A.0.01.300
close

Function

  • Alkaline electrolyte for electrolytic degreasing
  • Based on sodium and potassium hydroxide

DeGr

Helio® Clean Classic

Degreasing


Advantages

  • Optimized for degreasing of gravure cylinders
  • Degreasing anodic and cathodic or in combination
  • For steel, copper and chrome plating
  • Degreasing of steel, copper and chrome cylinders in one electrolyte (tank)
  • Degreasing for Steel and Copper in one electrolyte
  • For Steel, Copper and Chrome plating
  • Available as salt to save shipping costs and as liquid concentrate for easy handling
  • Short process time
  • Long lifetime

Process Time

  • 1–5 minutes

Process Parameter

  • Concentration
  • Concentration Salt
  • Density
  • Process Temperature
  • Current Density
  • Times and Polarity:
  • Steel          0 s              cathodic
  • Copper        0–160s      cathodic
  • 150 g/l
  • 100 g/l
  • ~ 9°Bé
  • 20–50°C
  • 8 A/dm²
  •  
  • 30–280 s anodic
  • 10–160 s anodic

Availability

Helio® Clean Classic Concentrate
Canister30 kgArt.Nr. 136209
IBC1000 kgArt.Nr. 136553
Helio® Clean Classic Salt
Bag22.5 kgArt.Nr. 104003

Analysis

Analysis Set DegreasingArt.Nr. 01A.0.01.601
Analysis Set Cu-CleanArt.Nr. 01A.0.01.600
close

Function

  • Creates a layer to separate the engraved copper (ballard shell)
  • Based on albumin

DeGr

Helio® Select Organic

Degreasing


Advantages

  • Saves shipping costs
  • High concentrated
  • Easy process handling
  • High reliable process
  • Smooth surface
  • Easy handling in waste water treatment

Process Time

  • Spray Time 15 sec
  • Reaction Time 20 sec

Process Parameter

  • Concentration
  • Process Temperature
  • 3 g/l
  • 20–30 °C

Availability

Helio® Select Organic Salt
Bottle1 kgArt.Nr. 125453
 10×30 gArt.Nr. 100438
close

Function

  • Creates a layer to separate the engraved copper (ballard shell)
  • Based on a silver complex

DeGr

Helio® Select Silver

Degreasing


Advantages

  • High concentrated
  • Easy process handling
  • High reliable process
  • Smooth surface
  • Easy handling in waste water treatment
  • Visible layer

Process Time

  • Spray Time 10 sec
  • Reaction Time 20 sec

Process Parameter

  • Concentration
  • Process Temperature
  • 1:19
  • 20–30 °C

Availability

Helio® Select Silver Concentrate
Canister10 LiterArt.Nr. 100434
20 LiterArt.Nr. 103994
Barrel220 LiterArt.Nr. 100436
close

Function

  • Alkaline electrolyte for electrolytic degreasing
  • Based on sodium and potassium hydroxide

DeGr

Helio®Clean Copper Concentrate


Advantages

  • Optimized for degreasing of gravure cylinders
  • Degreasing anodic and cathodic or in combination
  • Degreasing Coppercylinders in one electrolyte
  • For Copper and Chrome plating
  • As liquid concentrate for a easy handling
  • Short process time
  • Long live time

Process Time

  • 1 – 5 min

Process Parameter

  • Concentration
  • Concentration Salt
  • Density
  • Process Temperature
  • Current Density
  • Times and polarity
  • 150 g/l
  • 100 g/l
  • ~ 9°Bé
  • 20 – 50°C
  • 8 A/dm2
  • Steel 0 s cathodic 30 – 280 s anodic
  • Copper 0 – 160 s cathodic 10 – 160 s anodic

Availability

Helio®Clean Copper Concentrate
IBC1250 kgArt.Nr. 150117

Availability

Analysis Set DegreasingArt.Nr. 01A.0.01.601
Analysis Set Cu-CleanArt.Nr. 01A.0.01.600
close

Function

  • Coating of aluminum cylinders
  • Activates the aluminum to deposit with Helio® PreCopper or Helio® Chrome and Helio® Zinc
  • For base cylinder or embossing

PreAl

Helio® PreCoat Al

Aluminum coating


Advantages

  • Easy to handle
  • Reliable copper-aluminum bonding
  • Reliable chrome-aluminum bonding
  • Reliable zinc-aluminum bonding
  • Automatic process

Process Time

  • ~ 15 minutes

Process Parameter

  • Helio® Clean Al
  • Sulfuric/Nitric Acid
  • Helio® PrCoat Al
  • 55% DI-Water : 20% caustic souda : 25% HelioClean
  • 1:1 with DI-Water
  • 2:1 with DI-Water

Availability

Helio® Clean Al
Canister30 kgArt.Nr. 145489
Helio® PreCoat Al
Canister25 LiterArt.Nr. 145490
close

Function

  • Electrolyte for alkaline copper plating
  • Builds an adhesive layer of soft copper on steel
  • Phosphorus-copper complex

PreCu

Helio® PreCopper

Pre-Copper Plating


Advantages

  • One component process
  • Easy to handle
  • Stabilizes pH value
  • High concentrate (less shipping costs)
  • Reliable steel to copper adhesion
  • Reliable copper to copper adhesion
  • Storable after alkaline plating
  • Wide window of operation
  • Cyanide free

Process Time

  • Up to 4 µm copper layer in 25 minutes

Process Parameter

  • Copper (as metal)
  • Helio® PreCopper C
  • pH
  • Process Temperature
  • Current Density
  • Layer Thickness
  • 4 g/l
  • 20 % Vol
  • 9
  • 35–45°C
  • –2 A/dm²
  • 4 µm

Availability

Helio® PreCopper Concentrate
Canister20 Liter (24.55 kg)Art.Nr. 135739

Analysis

Analysis Set Alkaline CopperArt.Nr. 01A.0.01.500
close

Function

  • Copper plating with insoluble anode
  • External chemical copper dissolving
  • Copper hardness 200–250 HV

+Cu

Helio® CuMax

Copper Plating


Advantages

  • High speed copper plating
  • No nuggets in the anode basket
  • No anode basket maintenance
  • Low voltage plating (saving up to 30% energy costs)
  • 100% copper dissolving
  • Increased plating quality
  • Higher process stability
  • Higher process control (analysis of additive)
  • High layer plating up to 3000 µm

Process Time

  • Up to 5 µm copper layer per minute

Process Parameter

  • Helio® CuMax Basic Solution
  • Helio® CuMax Dosing Solution
  • Helio® CuMax Salt
  • Copper Sulphate
  • Sulphuric Acid
  • Chloride
  • Process Temperature
  • Current Density
  • 1.2 ml/l
  • 0.4 ml/l
  • 100 g/l
  • 220 g/l
  • 65 g/l
  • 75 ppm
  • 35 °C
  • –35 A/dm²

Availability

Helio® CuMax Basic Solution
Canister20 LiterArt.Nr. 139747
Helio® CuMax Dosing Solution
Canister20 LiterArt.Nr. 138534
Helio® CuMax Salt
Bag25 kgArt.Nr. 137497

Analysis

Analysis Set CuMaxArt.Nr. 01A.0.01.110
close

Function

  • Hardness additive for acid copper electrolytes
  • Based on thiourea
  • Copper hardness 190–220 HV

+Cu

Helio® Copper Classic

Copper Plating


Advantages

  • Well known technology
  • Stable process
  • No copper annealing
  • Compatible to most common used additives
  • High concentrated (1:14)
  • Available as salt (saves shipping costs)

Process Time

  • Up to 3 µm copper layer per minute

Process Parameter

  • Helio® Copper Classic
  • Dilution for dosing
  • Copper Sulphate
  • Sulphuric Acid
  • Process Temperature
  • Current Density
  • 0.15 ml/l
  • 1:14
  • 220 g/l
  • 60 g/l
  • 30 °C
  • –25 A/dm²

Availability

Helio® Copper Classic Concentrate
Canister10 LiterArt.Nr. 103992
20 LiterArt.Nr. 103993
Barrel220 LiterArt.Nr. 115406
Helio® Copper Classic Salt
Bottle500 grArt.Nr. 143604
1kgArt.Nr. 119999

Analysis

Analysis Set Cu QuickArt.Nr. 01A.0.01.101
Analysis Set Cu TitrationArt.Nr. 01A.0.01.100
close

Function

  • Additive for acid copper electrolytes
  • Based on thiourea
  • Copper hardness 190–220 HV

+Cu

Helio® Copper Rapid

Copper Plating


Advantages

  • Further developed technology
  • Based on well known system
  • High temperature resistant
  • Increased plating speed up to 4 µm per minute
  • Using all advantages of
    Helio® Copper Classic
  • High concentrated (1:17)
  • Available as salt (saves shipping costs)

Process Time

  • Up to 4 µm copper layer per minute

Process Parameter

  • Helio® Copper Rapid
  • Dilution for dosing
  • Copper Sulphate
  • Sulphuric Acid
  • Process Temperature
  • Current Density
  • 0.2 ml/l
  • 1:17
  • 220 g/l
  • 65 g/l
  • 40 °C
  • –30 A/dm²

Availability

Helio® Copper Rapid Concentrate
Canister20 LiterArt.Nr. 143325
Helio® Copper RE Agent
Canister10 LiterArt.Nr. 143326

Analysis

Analysis Set Cu QuickArt.Nr. 01A.0.01.101
Analysis Set Cu TitrationArt.Nr. 01A.0.01.100
close

Function

  • Zinc plating with acid electrolyte
  • Direct structuring with DLS, Digilas and Cellaxy
  • For gravure and embossing applications

Zn

Helio® Zinc

Zinc plating


Advantages

  • High plating speed
  • Easy process handling
  • Suitable for ballard shells or plating on size
  • Zinc as solvable anode material
  • No external peripheral equipment (carbonate freezing, zinc dissolving)
  • Low plating voltage
  • High corrosion resistance of the zinc layer
  • High quality zinc deposit
  • High current efficiency
  • High process stability
  • Plating up to 1000 µm

Process Time

  • Up to 3.5 µm zinc layer per minute

Process Parameter

  • Helio® Zinc Basic Solution
  • Helio® Zinc Dosing Solution
  • Zinc (ZnCl)
  • Boric Acid
  • Potassium Chloride
  • Process Temperature
  • Current Density
  • 30 ml/l
  • 2 ml/l
  • 35 – 40 g/l
  • 30 g/l
  • 140 – 150 g/l
  • ~ 50 °C
  • 15 – 30 A/dm2

Availability

Helio® Zinc Basic Solution
Canister25 kgArt.Nr. 145322
Helio® Zinc Dosing Solution
Canister25 kgArt.Nr. 145321
Helio® Zinc Wetting Agent
Canister25 kgArt.Nr. 145323

Analysis

Analysis Set ZnArt.Nr. 01A.0.01.700
close

Function

  • Cleans the laser structured copper surface
  • Post treatment for Cellaxy or Digilas laser process
  • For gravure or embossing applications

Laser

Helio® Laser FINISHER

Post treatment


Advantages

  • Cleans and activates the copper structure
  • Ensures chrome plating on all structures
  • Easy process handling

Process Time

  • ~ 15 minutes

Process Parameter

  • Helio® Laser Finisher
  • Phosphor Acid
  • Process Temperature
  • Current Density
  • ~ 40 ml/l
  • 1000 g/l
  • – 25 °C
  • – 30 A/dm2

Availability

Helio® Laser Finisher
Canister25 kgArt.Nr. 139931

Analysis

Analysis Set Laser FinisherArt.Nr. 01A.0.01.800
close

Function

  • Activates the lasered copper structure for chrome plating
  • For direct laser structuring of the copper with Digilas

Laser

Helio® Laser ACTIVATOR

Post treatment


Advantages

  • Cleans and activates the copper structure
  • Ensures chrome plating on all structures
  • Simple spraying process
  • Capable of being integrated in degreasing tanks

Process Time

  • ~ 5 minutes

Process Parameter

  • Helio® Laser Activator
  • Sulfuric Acid
  • ~ 40 g/l
  • 10 % Vol

Availability

Helio® Laser Activator
Bottle5 kgArt.Nr. 144066
close

Function

  • Elektrolyte for chrome plating
  • Based on chrome (VI) acid
  • Chrome hardness 850–1000 HV

+Cr

Helio® Chrome Classic

Chrome Plating


Advantages

  • High ware ability during printing
  • Easy to handle
  • Stabile sulfuric acid content
  • Wide window of operation
  • Also available as concentrate (no dust)

Process Time

  • Up to 0.35 µm per minute

Process Parameter

  • Chromic Acid
  • Sulphuric Acid
  • Process Temperature
  • Current Density
  • 260 g/l
  • 2.5 g/l
  • 55–60 °C
  • 50–60 A/dm²

Availability

Helio® Chrome Classic Salt
Barrel25 kgArt.Nr. 100400
Helio® Chrome Classic Concentrate
Barrel250 kgArt.Nr. 142317

Analysis

Analysis Set Cr QuickArt.Nr. 01A.0.01.200
Analysis Set CrO3/Cr2O3Art.Nr. 01A.0.01.201
close

Function

  • Catalyzed electrolyte for chrome plating
  • Based on chromic acid
  • Chrome hardness 1100–1500 HV

+Cr

Helio® Chrome Rapid

Chrome Plating


Advantages

  • High current efficiency 25–30%
  • High deposition rates
  • High micro-cracking (300–600 cracks/cm)
  • Wide current density range
  • Wide current density range (40–120 A/dm²)
  • Good metal distribution
  • Smooth and bright deposition
  • Low service costs
  • Automatic dosing

Process Time

  • Up to 0.6 µm chrome layer per minute

Process Parameter

  • Chromic Acid
  • Sulphate
  • Catalyst
  • Density
  • Temperature
  • Current Density
  • 240–340 g/l
  • 2.6–3.8 g/l
  • 100-180%
  • 22–29°Bé
  • 60 °C
  • 40–120 A/dm²

Availability

Helio® Chrome Rapid MakeUp Concentrate
IBC600-1100 kg Single-Wall
1200 kgSingle-Wall
Helio® Chrome Rapid for Dosing
Canister25 kg
Barrel250 kg
IBC600 kgSingle-Wall and Poly
IBC1200 kgSingle-Wall and Poly
Helio® Chrome Rapid Catalyst
Canister20 LiterArt.Nr. 142452
Helio® Chrome REOX3
Canister5 kgArt.Nr. 149972
Helio® Chrome Wetting Agent FF
Canister10 kgArt.Nr. 142452149169

Analysis

Analysis Set Cr QuickArt.Nr. 01A.0.01.200
Analysis Set CrO3/Cr2O3Art.Nr. 01A.0.01.201
close



Back To Top